HP Palm

Shipping Flagship Smartphones in the webOS Era

I was a key member of the mechanical engineering team that shipped the Palm Pre 2 and Palm Pre 3. Working within a high-velocity hardware environment, I designed critical mechanical components and collaborated on the system architecture for these flagship smartphones.

I coordinated directly with ODMs and vendors to drive parts from concept to shipping, analyzing reliability data to implement design fixes for mass manufacturing.

Key Impact

• Shipping: Launched two major smartphones (Pre 2 & Pre 3)
• R&D: Prototyped future hardware concepts including foldables and biometrics